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Bicheng has been offering ball-grid array(BGA) printed circuit boards for many interconnection pins devices such as microprocessors. |
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Minimum diameter of BGA pad (measured in mils) |
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| Prototype |
10 |
| Small volume |
12 |
| Volume production |
12 |
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Minimum diameter of pad via (measured in mils) |
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| Prototype |
16 |
| Small volume |
16 |
| Volume production |
20 |
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PCB Products & Services |
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* FR-4 TG>135, High TG170, High CTI 600V |
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* MCPCB 1W/MK- 3W/MK thermal conductivity |
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* RO4350B, RO4003C material |
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* Rogers Multi-layer PCB |
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* Quick turn around (QTA) prototypes |
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* Double sided and Multi-layer PCB |
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* HASL lead free, ENIG, Immersion Silver, Immersion tin. |
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* Prototype to Small batch and volume production |
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* Door to door shipment service |
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* No minimum order quantity(MOQ) required |
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